Conference Papers
E. Göktepe and N. Dönmezer, "Current Crowding Effects on the Thermal Performance of AlGaN/GaN Light Emitting Diodes," 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 2021, pp. 473-478, doi: 10.1109/EPTC53413.2021.9663998.
O. Kaya and N. Donmezer, "Investigation of the Thermal Conductivity of Materials in 2D/3D Heterostructures," 2021 IEEE 21st International Conference on Nanotechnology (NANO), 2021, pp. 374-377, doi: 10.1109/NANO51122.2021.9514284.
T. Meydando and N. Donmezer, "Performance Analysis of Micro-Raman Spectroscopy Models for Thermal Conductivity Calculation." Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. October 26–28, 2021. https://doi.org/10.1115/IPACK2021-73648
C. Dundar and N. Donmezer, "Thermal Characterization of Field Plated AlGaN/GaN HEMTs," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), pp. 755-760, 2019.
I. Albar and N. Donmezer, "Phonon Mean Free Path-Thermal Conductivity Relation in AlN," 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), pp. 127-130, 2019.
N. Donmezer, I. Albar, and C. Dundar, "Micro-Raman Temperature Measurements of Field-Plated AlGaN-GaN HFETs," NMHT-VI: Nanoscale and Microscale Heat Transfer 2018, 2018.
D. Kara and F. N. Donmezer Akgun, "Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation," ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems, vol. 1, pp. 4-11, 2017.
H. Gholivand and N. Donmezer, “Nanoscale thermal transport in single, bilayer graphene, and graphite,” 2016 IEEE Nanotechnology Materials and Devices Conference (NMDC), pp. 1–2, 2016.
M. Azarifar and N. Donmezer, "A Roadmap for Building Thermal Models for AlGaN/GaN HEMTs: Simplifications and Beyond," ASME 2016 Heat Transfer Summer Conference collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2016.
D. Kara, N. Donmezer, T. F. Canan, O. Sen, and E. Ozbay, “Effects of field plate on the maximum temperature and temperature distribution for gan HEMT devices,” ASME 2016 Heat Transfer Summer Conference, HT 2016, collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels, vol. 1, 2016.
F. N. Donmezer and S. Graham, "Phonon Mean Free Path and Thermal Conductivity Relation for Gallium Nitride," ASTFE Digital Library, 2015.
F. N. Donmezer, M. Islam, S. Graham, and D. Yoder, "Modeling the hotspot temperature in AlGaN/GaN high electron mobility transistors using a non-gray phonon BTE solver," ASME 2012 International Mechanical Engineering Congress and Exposition, pp. 1175-1188, 2012.
F. N. Donmezer, D. Singh, W. James, A. Christensen, S. Graham, and J. Y Murthy, "Lattice boltzmann and discrete ordinates methods for phonon transport modeling: A comparative study," ASME 2011 International Mechanical Engineering Congress and Exposition, pp. 333-343, 2011.
F. N. Donmezer, M. P Menguc, and T. Okutucu-Ozyurt, "Dependent absorption and scattering by interacting nanoparticles," ICHMT DIGITAL LIBRARY ONLINE, 2010.
